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新產品簡介-加強型焊柱Cu-CCGA

 

    加強型錫柱是在普通錫柱的基礎上演變而來。通過在普通焊線上繞一定規格的銅線，然后在進行電鍍Sn63/Pb37合金形成良好的外觀。加強型焊柱具有比普通焊錫柱更好的熱循環性能，同時在CCGA封裝時，Sn20/Pb80（固相點183℃，液相點280℃）合金具有更好的回流焊窗口。

      Copper wrap solder columns based on the plain solder columns are an advnced development.we will wind a certain size copper wires or copper foils around the core solder wire, then The hot solder coating(Sn63/Pb37 eutectic alloy) is appendedCompared with traditional plain solder columns,copper wrap solder columns have better thermal cycling ability, and Sn20/Pb80 alloy (The solidus temperature, 183℃, the liquidus temperature, 280℃) makes it more suitable for reflow soldering window.